In a press event held earlier this morning in Taiwan, Mediatek announced its latest chipsets: Helio X30 (flagship SoC) along with two mid-range series Helio P20 and Helio P25, all of which will be embedded in next-gen devices expected to launch in the first half of 2017.
MediaTek Helio X30 adopted the same deca-core CPU, however the manufacturing process bar has been heightened by TSMC to 10nm, as well as the clocking frequency of the processor.
Helio X30 configuration is as follows: 2 x Cortex-A73 cores clocked at 2.8GHz + 4 x Cortex A53 cores clocked at 2.2GHz + 4 x Cortex-A35 cores clocked at 2GHz and it brings support for up to 8GB of 1866MHz LPDDR4x RAM, up to 28MP @30 frames per second faster image processing, support for eMMC 5.1 and UFS 2.1, video encoding, better audio, faster fingerprint processor and category 10 LTE among other things. MediaTek promises up to 43% more performance from the Helio X30 and is up to 58% more power efficient in comparison to the current Helio X20 chipset. The GPU integrated in this chip is the PowerVR 7XT, which also offers up to 2.4 x higher graphics processing speeds.
In addition, MediaTek’s Helio X30 chipset will support displays with up to WQXGA screen resolution.