Ascend D3 purported hardware specs hit the Internet.
A piece of document that contains Huawei Ascend D3 alleged hardware specifications has been posted on Weibo microblogging network. The document reveals that Huawei is about to break another world record in terms of smartphone thinnes, as they did last year when the Chinese OEM introduced the Ascend P6. Huawei Ascend D3 will apparently measure only 6.3mm in thickness.
Other specs leaked from this document are a 4.9-inch display (we cant confirm at this time if its a HD or a Full HD screen), it is powered by a Huawei-made HiSillicon 1.8GHz processor (quad or it could be the upcoming octa-core chipset), 16MP rear-facing camera, and it will be available this year in Blue and White colors.
Huawei already has from previous years in its high-end device portfolio two Ascend D series phones, the Ascend D1 and the Ascend D2, and it looks like the tradition will continues in 2014 with the introduction of Ascend D3, which could happen later this month at Mobile World Congress, in Barcelona.