Qualcomm Announces 4G LTE Advanced Embedded Platform for Mobile Devices

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qualcomm_largeToday at MWC, Qualcomm announced new 4G LTE Advanced modems, that should boast speeds of 150Mbps. That’s an unimaginable speed, especially taking it into count that most of us have WiFi networks that don’t even come close to that numbers.

The chips are based on Qualcomm Gobi MDM9225 and MDM9625 chipsets and supports LTE Category 4 and more LTE bands than current LTE modems. These modems could be used in everything from laptops to smartphones in tablets, only if the manufacturers wand to embed them. Production of the chips has started, and they will begin conquering the market in Q2 2013.

If you want to get into more details, here’s the full press release:

BARCELONA – February 25, 2013 – Qualcomm Technologies, Inc., a wholly-owned subsidiary of Qualcomm Incorporated (NASDAQ: QCOM), today announced the industry’s first 4G LTE Advanced embedded data connectivity platform for mobile computing devices, including thin form factor laptops, tablets and convertibles. The technology, based on Qualcomm Technologies’ Gobi chipsets — the MDM9225™ and MDM9625™ — is the first embedded, mobile computing solution to support LTE carrier aggregation and LTE Category 4 with peak data rates of up to 150Mbps.

The introduction marks the arrival of Qualcomm Technologies’ third-generation 4G LTE embedded chip, extends Qualcomm Technologies’ modem technology leadership in mobile computing, and promises to deliver the fastest 3G and 4G LTE connections worldwide, while offering the broadest multi-region coverage via a single SKU solution. PC OEM customers can now select from a broad ecosystem of embedded module vendors that support a range of Gobi chipsets, from 3G solutions with speeds up to 42Mbps to cutting-edge 4G LTE Advanced. Coupled with new and innovative pay-as-you-go, no contract data plans, these products enable thinner, lighter and better connected mobile computing devices running leading operating systems such as iOS, Android, Windows 8 and Windows RT, and support a variety of modules for thin form factors, including PCI Express Mini Card, PCI Express M.2, and Land Grid Array. The Gobi MDM9x25 embedded platform also includes an embedded GPS receiver with GLONASS support for enhanced asset tracking, turn-by-turn navigation and other location-based services. Additionally, the Qualcomm RF360 Front End solution, providing expanded active band support integral to Qualcomm Technologies’ single SKU LTE World Mode solution will also be included.

“Our broad portfolio of Gobi chipsets — including 3G 42Mbps, 4G LTE and 4G LTE Advanced — features industry-leading LTE multiband support for seamless connections to the fastest networks worldwide,” said Cristiano Amon, executive vice president of Qualcomm Technologies and co-president of Qualcomm Mobile Computing. “This latest addition can be easily implemented across enterprise, SMB and consumer industries allowing end users to download and stream rich HD content, access enterprise applications, share large files quickly and connect virtually wherever they are in the world.”

Qualcomm Gobi MDM9x25 chipsets began sampling to module vendors last November and will enable commercial device launches in the second half of this calendar year.

“Fujitsu’s mobile computing portfolio is adapting to meet the changing needs of today’s workers. In addition to new and innovative form factors, connectivity is increasingly important, which is why we rely on Qualcomm Technologies’ Gobi technology,” said Akira Nagahara, senior vice president, Personal Systems Business Unit, Fujitsu Ltd. “Gobi modems enable us to offer the fastest LTE connections our customers demand across a range of devices, including the latest Fujitsu hybrid tablets and convertible laptops.”

Qualcomm Gobi embedded mobile broadband connectivity is a compelling solution for users of our ThinkPad laptops, further enhancing wireless access options to offer connection virtually anywhere” said Dilip Bhatia,